GB/T 16595-2019

Active

Specification for a universal wafer grid

晶片通用网格规范

Standard Type

GBT

ICS

29.045

CCS

H80

Status

Active

Issue Date

2019-03-25

Implementation

2020-02-01

Centralized Committee

国家标准委

Issuing Authority

国家市场监督管理总局、中国国家标准化管理委员会

Application Summary AI generated

GB/T 16595-2019 defines a standardized grid pattern for semiconductor wafers, specifying coordinate systems and dimensional references for wafer mapping. It is applied in the semiconductor manufacturing industry for process control, defect inspection, and equipment alignment, ensuring consistent wafer handling and data comparison across different fabrication tools and testing systems.

Related Standards

GB/T 12964-2003 Monocrystalline silicon polished wafers GB/T 16596-1996 Specification for establishing a wafer coordinatesystem GB/T 16595-1996 Specification for a universal wafer grid GB/T 12965-2005 Monocrystalline silicon as cut slices and lapped slices GB/T 20230-2006 Indium phosphide single crystal GB/T 20229-2006 Gallium phosphide single crystal GB/T 20228-2006 Gallium arsenide single crystal GB/T 11071-2006 Zone-refined germanium ingot

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.